Conference
Research on Sintering Performance Optimization of Large-Area Cu Sintering for Press-Pack IGBT Packaging
| Τίτλος: | Research on Sintering Performance Optimization of Large-Area Cu Sintering for Press-Pack IGBT Packaging |
|---|---|
| Συγγραφείς: | Zhang, Zhiyuan, Liang, Lin, Wang, Yizhu, Tu, Liuyu, Wang, Ke |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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