Conference

Research on Sintering Performance Optimization of Large-Area Cu Sintering for Press-Pack IGBT Packaging

Bibliographic Details
Title: Research on Sintering Performance Optimization of Large-Area Cu Sintering for Press-Pack IGBT Packaging
Authors: Zhang, Zhiyuan, Liang, Lin, Wang, Yizhu, Tu, Liuyu, Wang, Ke
Source: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026
Relation: 2026 27th International Conference on Electronic Packaging Technology (ICEPT)
Database: IEEE Xplore Digital Library
Description
ISBN:9798319531117
9798319531124
ISSN:28369734
DOI:10.1109/ICEPT71373.2026.11690287