Conference
Optimization of a Multimodal Deep Learning Model for Warpage Prediction of Fan-Out Wafer-Level Packaging
| Τίτλος: | Optimization of a Multimodal Deep Learning Model for Warpage Prediction of Fan-Out Wafer-Level Packaging |
|---|---|
| Συγγραφείς: | Zhao, Xiaohui, Jia, Yuxi |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-6 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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