Zhao, X., & Jia, Y. (2026). Optimization of a Multimodal Deep Learning Model for Warpage Prediction of Fan-Out Wafer-Level Packaging. 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on, 1. https://doi.org/10.1109/ICEPT71373.2026.11690206
Παραπομπή σε μορφή Chicago (17η εκδ.)Zhao, Xiaohui, και Yuxi Jia. "Optimization of a Multimodal Deep Learning Model for Warpage Prediction of Fan-Out Wafer-Level Packaging." 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on 2026: 1. https://doi.org/10.1109/ICEPT71373.2026.11690206.
Παραπομπή σε μορφή MLA (9th εκδ.)Zhao, Xiaohui, και Yuxi Jia. "Optimization of a Multimodal Deep Learning Model for Warpage Prediction of Fan-Out Wafer-Level Packaging." 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on, 2026, p. 1, https://doi.org/10.1109/ICEPT71373.2026.11690206.