Conference
Pressureless Sintering of Ag Paste on Cu Interface in N2 Atmosphere Assisted by Silver Acetate
| Τίτλος: | Pressureless Sintering of Ag Paste on Cu Interface in N2 Atmosphere Assisted by Silver Acetate |
|---|---|
| Συγγραφείς: | Huang, Jinshun, Huang, Qiuyan, Cen, Wei, Xu, Yaohua, Jiang, Han, Li, Junjie |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-6 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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