Conference
One-Pot Aqueous-Synthesized Submicron Cu Particles Enabling Air-Sinterable Paste for Wide-Bandgap Die Attachment
| Τίτλος: | One-Pot Aqueous-Synthesized Submicron Cu Particles Enabling Air-Sinterable Paste for Wide-Bandgap Die Attachment |
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| Συγγραφείς: | Qin, Jian-Yun, Zhou, Min-Bo, Zong, Hao-Ze, Hou, Bin, Zhang, Xin-Ping |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-4 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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