Conference
A Process Window Study of Pressure-Assisted Copper Paste Sintering for Die-Attach Applications
| Τίτλος: | A Process Window Study of Pressure-Assisted Copper Paste Sintering for Die-Attach Applications |
|---|---|
| Συγγραφείς: | Zong, Qihang, Wang, Xiaowei, Lin, Jieming, Zhang, Xiaowei, Yu, Gongchi, Guo, Jinhu, Ye, Huaiyu |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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