Conference
A New Method for Preparing Low-Temperature Copper Paste via Powder Pre-Deformation
| Τίτλος: | A New Method for Preparing Low-Temperature Copper Paste via Powder Pre-Deformation |
|---|---|
| Συγγραφείς: | Liu, Jiasheng, Cao, Qi, Ma, Haoran, Liu, Jiawei, Yu, He, Zhang, Xushuo, Ren, Zeen, Cai, Yiyang, Liang, Hongwei |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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