Conference
Rapid Low-temperature Sintering of Cu Microparticles with PEG via a Pre-Drying Process
| Title: | Rapid Low-temperature Sintering of Cu Microparticles with PEG via a Pre-Drying Process |
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| Authors: | Jiang, Wenpeng, Yin, Dongxian, Yu, Zibo, Ouyang, Yuzhi, Yan, Haidong, He, Siliang |
| Source: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Database: | IEEE Xplore Digital Library |
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