Academic Journal
A 950 °C-Thermal-Budget-Compatible Al2O3-Embedded Hf0.5Zr0.5O2 Poly-Si Channel- Last FeFET for 3-D NAND Applications
| Τίτλος: | A 950 °C-Thermal-Budget-Compatible Al2O3-Embedded Hf0.5Zr0.5O2 Poly-Si Channel- Last FeFET for 3-D NAND Applications |
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| Συγγραφείς: | Fan, W., Ke, X., Ding, Y., Shao, X., Dai, S., Hu, T., Han, R., Liao, M., Jia, X., Tian, F., Li, T., Tang, B., Chai, J., Xu, H., Luo, Q., Wang, X., Wang, W., Ye, T. |
| Πηγή: | IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 73(9):5867-5871 Sep, 2026 |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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