Academic Journal
TSV-W for 2.5-D IC Wireless Interconnects
| Title: | TSV-W for 2.5-D IC Wireless Interconnects |
|---|---|
| Authors: | Anim, K., Taskin, B., Ganguly, A., Dandekar, K.R. |
| Source: | IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 34(10):3126-3136 Oct, 2026 |
| Database: | IEEE Xplore Digital Library |
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