Academic Journal
A Scalable Stress Recovery Technique for Hybrid Bonding in Chiplet-Based Systems
| Title: | A Scalable Stress Recovery Technique for Hybrid Bonding in Chiplet-Based Systems |
|---|---|
| Authors: | Wang, Y., Zhan, Q., Zhang, H., Zhu, Y., Yin, W. |
| Source: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manuf. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 16(9):2148-2156 Sep, 2026 |
| Database: | IEEE Xplore Digital Library |
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