Wang, Y., Zhan, Q., Zhang, H., Zhu, Y., & Yin, W. (2026). A Scalable Stress Recovery Technique for Hybrid Bonding in Chiplet-Based Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manuf. Technol., 16(9), 2148. https://doi.org/10.1109/TCPMT.2026.3723892
Παραπομπή σε μορφή Chicago (17η εκδ.)Wang, Y., Q. Zhan, H. Zhang, Y. Zhu, και W. Yin. "A Scalable Stress Recovery Technique for Hybrid Bonding in Chiplet-Based Systems." IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manuf. Technol. 16, no. 9 (2026): 2148. https://doi.org/10.1109/TCPMT.2026.3723892.
Παραπομπή σε μορφή MLA (9th εκδ.)Wang, Y., et al. "A Scalable Stress Recovery Technique for Hybrid Bonding in Chiplet-Based Systems." IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manuf. Technol., vol. 16, no. 9, 2026, p. 2148, https://doi.org/10.1109/TCPMT.2026.3723892.