Academic Journal

Edge Effect Compensation Algorithm for Eddy Current Endpoint Detection System in the CMP Process

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Τίτλος: Edge Effect Compensation Algorithm for Eddy Current Endpoint Detection System in the CMP Process
Συγγραφείς: Ting, L., Kang, Z., Jianwei, W., Jiubin, T.
Πηγή: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 39(3):549-554 Aug, 2026
Βάση Δεδομένων: IEEE Xplore Digital Library
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  – Url: https://resolver.ebsco.com/c/fiv2js/result?sid=EBSCO:edseee&genre=article&issn=08946507&ISBN=&volume=39&issue=3&date=20260801&spage=549&pages=549-554&title=IEEE Transactions on Semiconductor Manufacturing, Semiconductor Manufacturing, IEEE Transactions on, IEEE Trans. Semicond. Manufact.&atitle=Edge%20Effect%20Compensation%20Algorithm%20for%20Eddy%20Current%20Endpoint%20Detection%20System%20in%20the%20CMP%20Process&aulast=Ting%2C%20L.&id=DOI:10.1109/TSM.2026.3705753
    Name: Full Text Finder (for New FTF UI) (ns324271)
    Category: fullText
    Text: Full Text Finder
    MouseOverText: Full Text Finder
Header DbId: edseee
DbLabel: IEEE Xplore Digital Library
An: edseee.11573776
RelevancyScore: 1163
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 1162.97290039063
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Edge Effect Compensation Algorithm for Eddy Current Endpoint Detection System in the CMP Process
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Ting%2C+L%2E%22">Ting, L.</searchLink><br /><searchLink fieldCode="AR" term="%22Kang%2C+Z%2E%22">Kang, Z.</searchLink><br /><searchLink fieldCode="AR" term="%22Jianwei%2C+W%2E%22">Jianwei, W.</searchLink><br /><searchLink fieldCode="AR" term="%22Jiubin%2C+T%2E%22">Jiubin, T.</searchLink>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 39(3):549-554 Aug, 2026
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edseee&AN=edseee.11573776
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1109/TSM.2026.3705753
    PhysicalDescription:
      Pagination:
        PageCount: 6
        StartPage: 549
    Titles:
      – TitleFull: Edge Effect Compensation Algorithm for Eddy Current Endpoint Detection System in the CMP Process
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Ting, L.
      – PersonEntity:
          Name:
            NameFull: Kang, Z.
      – PersonEntity:
          Name:
            NameFull: Jianwei, W.
      – PersonEntity:
          Name:
            NameFull: Jiubin, T.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 08
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 08946507
            – Type: issn-print
              Value: 15582345
            – Type: issn-locals
              Value: edseee.IEEEJournals
          Numbering:
            – Type: volume
              Value: 39
            – Type: issue
              Value: 3
          Titles:
            – TitleFull: IEEE Transactions on Semiconductor Manufacturing, Semiconductor Manufacturing, IEEE Transactions on, IEEE Trans. Semicond. Manufact.
              Type: main
ResultId 1