Academic Journal
Edge Effect Compensation Algorithm for Eddy Current Endpoint Detection System in the CMP Process
| Τίτλος: | Edge Effect Compensation Algorithm for Eddy Current Endpoint Detection System in the CMP Process |
|---|---|
| Συγγραφείς: | Ting, L., Kang, Z., Jianwei, W., Jiubin, T. |
| Πηγή: | IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 39(3):549-554 Aug, 2026 |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| FullText | Text: Availability: 0 CustomLinks: – Url: https://resolver.ebsco.com/c/fiv2js/result?sid=EBSCO:edseee&genre=article&issn=08946507&ISBN=&volume=39&issue=3&date=20260801&spage=549&pages=549-554&title=IEEE Transactions on Semiconductor Manufacturing, Semiconductor Manufacturing, IEEE Transactions on, IEEE Trans. Semicond. Manufact.&atitle=Edge%20Effect%20Compensation%20Algorithm%20for%20Eddy%20Current%20Endpoint%20Detection%20System%20in%20the%20CMP%20Process&aulast=Ting%2C%20L.&id=DOI:10.1109/TSM.2026.3705753 Name: Full Text Finder (for New FTF UI) (ns324271) Category: fullText Text: Full Text Finder MouseOverText: Full Text Finder |
|---|---|
| Header | DbId: edseee DbLabel: IEEE Xplore Digital Library An: edseee.11573776 RelevancyScore: 1163 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 1162.97290039063 |
| IllustrationInfo | |
| Items | – Name: Title Label: Title Group: Ti Data: Edge Effect Compensation Algorithm for Eddy Current Endpoint Detection System in the CMP Process – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Ting%2C+L%2E%22">Ting, L.</searchLink><br /><searchLink fieldCode="AR" term="%22Kang%2C+Z%2E%22">Kang, Z.</searchLink><br /><searchLink fieldCode="AR" term="%22Jianwei%2C+W%2E%22">Jianwei, W.</searchLink><br /><searchLink fieldCode="AR" term="%22Jiubin%2C+T%2E%22">Jiubin, T.</searchLink> – Name: TitleSource Label: Source Group: Src Data: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 39(3):549-554 Aug, 2026 |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edseee&AN=edseee.11573776 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/TSM.2026.3705753 PhysicalDescription: Pagination: PageCount: 6 StartPage: 549 Titles: – TitleFull: Edge Effect Compensation Algorithm for Eddy Current Endpoint Detection System in the CMP Process Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Ting, L. – PersonEntity: Name: NameFull: Kang, Z. – PersonEntity: Name: NameFull: Jianwei, W. – PersonEntity: Name: NameFull: Jiubin, T. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 08 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 08946507 – Type: issn-print Value: 15582345 – Type: issn-locals Value: edseee.IEEEJournals Numbering: – Type: volume Value: 39 – Type: issue Value: 3 Titles: – TitleFull: IEEE Transactions on Semiconductor Manufacturing, Semiconductor Manufacturing, IEEE Transactions on, IEEE Trans. Semicond. Manufact. Type: main |
| ResultId | 1 |