Conference
Neural Surrogates for Fast Signal and Power Integrity Co-Simulation and Co-design of Chiplets Integration
| Τίτλος: | Neural Surrogates for Fast Signal and Power Integrity Co-Simulation and Co-design of Chiplets Integration |
|---|---|
| Συγγραφείς: | Liu, En-Xiao, Gao, Richard Xian-Ke, Yang, Zaifeng, Liu, Jun, Lu, Dingjie, Rotaru, Mihai D., Rahul, Dutta, Sridhar, N. |
| Πηγή: | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :985-990 May, 2026 |
| Relation: | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| FullText | Text: Availability: 0 |
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| Header | DbId: edseee DbLabel: IEEE Xplore Digital Library An: edseee.11561412 RelevancyScore: 1161 AccessLevel: 2 PubType: Conference PubTypeId: conference PreciseRelevancyScore: 1160.61352539063 |
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| Items | – Name: Title Label: Title Group: Ti Data: Neural Surrogates for Fast Signal and Power Integrity Co-Simulation and Co-design of Chiplets Integration – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Liu%2C+En-Xiao%22">Liu, En-Xiao</searchLink><br /><searchLink fieldCode="AR" term="%22Gao%2C+Richard+Xian-Ke%22">Gao, Richard Xian-Ke</searchLink><br /><searchLink fieldCode="AR" term="%22Yang%2C+Zaifeng%22">Yang, Zaifeng</searchLink><br /><searchLink fieldCode="AR" term="%22Liu%2C+Jun%22">Liu, Jun</searchLink><br /><searchLink fieldCode="AR" term="%22Lu%2C+Dingjie%22">Lu, Dingjie</searchLink><br /><searchLink fieldCode="AR" term="%22Rotaru%2C+Mihai+D%2E%22">Rotaru, Mihai D.</searchLink><br /><searchLink fieldCode="AR" term="%22Rahul%2C+Dutta%22">Rahul, Dutta</searchLink><br /><searchLink fieldCode="AR" term="%22Sridhar%2C+N%2E%22">Sridhar, N.</searchLink> – Name: TitleSource Label: Source Group: Src Data: 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :985-990 May, 2026 – Name: NoteTitleSource Label: Relation Group: SrcInfo Data: 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edseee&AN=edseee.11561412 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/ECTC51846.2026.00165 PhysicalDescription: Pagination: PageCount: 6 StartPage: 985 Titles: – TitleFull: Neural Surrogates for Fast Signal and Power Integrity Co-Simulation and Co-design of Chiplets Integration Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Liu, En-Xiao – PersonEntity: Name: NameFull: Gao, Richard Xian-Ke – PersonEntity: Name: NameFull: Yang, Zaifeng – PersonEntity: Name: NameFull: Liu, Jun – PersonEntity: Name: NameFull: Lu, Dingjie – PersonEntity: Name: NameFull: Rotaru, Mihai D. – PersonEntity: Name: NameFull: Rahul, Dutta – PersonEntity: Name: NameFull: Sridhar, N. IsPartOfRelationships: – BibEntity: Dates: – D: 26 M: 05 Type: published Y: 2026 Identifiers: – Type: isbn-print Value: 9798331564179 – Type: isbn-print Value: 9798331564186 – Type: issn-print Value: 23775726 – Type: issn-print Value: 05695503 – Type: issn-locals Value: edseee.IEEEConferenc Titles: – TitleFull: 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th, ECTC Type: main |
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