APA (7th ed.) Citation

Liu, E., Gao, R. X., Yang, Z., Liu, J., Lu, D., Rotaru, M. D., . . . Sridhar, N. (2026). Neural Surrogates for Fast Signal and Power Integrity Co-Simulation and Co-design of Chiplets Integration. 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th, ECTC, 985. https://doi.org/10.1109/ECTC51846.2026.00165

Chicago Style (17th ed.) Citation

Liu, En-Xiao, Richard Xian-Ke Gao, Zaifeng Yang, Jun Liu, Dingjie Lu, Mihai D. Rotaru, Dutta Rahul, and N. Sridhar. "Neural Surrogates for Fast Signal and Power Integrity Co-Simulation and Co-design of Chiplets Integration." 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th, ECTC 2026: 985. https://doi.org/10.1109/ECTC51846.2026.00165.

MLA (9th ed.) Citation

Liu, En-Xiao, et al. "Neural Surrogates for Fast Signal and Power Integrity Co-Simulation and Co-design of Chiplets Integration." 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th, ECTC, 2026, p. 985, https://doi.org/10.1109/ECTC51846.2026.00165.