Conference
Electrodeposition of Aluminum on Direct Bonded Copper Substrates for Power Module Packaging
| Τίτλος: | Electrodeposition of Aluminum on Direct Bonded Copper Substrates for Power Module Packaging |
|---|---|
| Συγγραφείς: | Anh Dao, Thi Minh, Jian, Ming-Si, Hoang, Phuong Thao, Chu, Peng-Wei, Chen, Chun-Hao |
| Πηγή: | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :2066-2069 May, 2026 |
| Relation: | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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