Conference
Introduction to High-Speed LVDS Twisted Pair Transmission Across PCB and Chiplet RDL Interfaces
| Τίτλος: | Introduction to High-Speed LVDS Twisted Pair Transmission Across PCB and Chiplet RDL Interfaces |
|---|---|
| Συγγραφείς: | Nandy, Mayukh, Doyle, James, Mayberry, Simon, Liu, Siyang, Sarode, Anuj, Yu, Hongbin |
| Πηγή: | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :2178-2182 May, 2026 |
| Relation: | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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