Academic Journal
Modeling of Stress-Driven Void Evolution at the Cu–Cu Hybrid Bonding Interface
| Τίτλος: | Modeling of Stress-Driven Void Evolution at the Cu–Cu Hybrid Bonding Interface |
|---|---|
| Συγγραφείς: | Kim, W., Kang, S., Kim, S., Kim, D., Park, K., Yu, H. |
| Πηγή: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manuf. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 16(8):1702-1710 Aug, 2026 |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
καταχωρήστε σχόλιο πρώτοι!