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Modeling of Stress-Driven Void Evolution at the Cu–Cu Hybrid Bonding Interface

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Τίτλος: Modeling of Stress-Driven Void Evolution at the Cu–Cu Hybrid Bonding Interface
Συγγραφείς: Kim, W., Kang, S., Kim, S., Kim, D., Park, K., Yu, H.
Πηγή: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manuf. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 16(8):1702-1710 Aug, 2026
Βάση Δεδομένων: IEEE Xplore Digital Library
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PubType: Academic Journal
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  Data: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manuf. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 16(8):1702-1710 Aug, 2026
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        Value: 10.1109/TCPMT.2026.3702803
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        PageCount: 9
        StartPage: 1702
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