Conference
A Flip Chip Embedded PCB Power Module with Double Sided Cooling and Low Parasitic Inductance for Fine Pad Power Devices
| Τίτλος: | A Flip Chip Embedded PCB Power Module with Double Sided Cooling and Low Parasitic Inductance for Fine Pad Power Devices |
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| Συγγραφείς: | Kao, H. C., Lin, H. H., Huang, Y. C., Chiu, P. K., Lin, A. Y., Lin, C. L., Liu, W. H., Yeh, Y. C., Ko, H. K., Chang, T. C. |
| Πηγή: | 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), 2026 International Conference on. :349-350 Apr, 2026 |
| Relation: | 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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