Kao, H. C., Lin, H. H., Huang, Y. C., Chiu, P. K., Lin, A. Y., Lin, C. L., . . . Chang, T. C. (2026). A Flip Chip Embedded PCB Power Module with Double Sided Cooling and Low Parasitic Inductance for Fine Pad Power Devices. 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), 2026 International Conference on, 349. https://doi.org/10.23919/ICEP-HBS69241.2026.11550466
Παραπομπή σε μορφή Chicago (17η εκδ.)Kao, H. C., et al. "A Flip Chip Embedded PCB Power Module with Double Sided Cooling and Low Parasitic Inductance for Fine Pad Power Devices." 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), 2026 International Conference on 2026: 349. https://doi.org/10.23919/ICEP-HBS69241.2026.11550466.
Παραπομπή σε μορφή MLA (9th εκδ.)Kao, H. C., et al. "A Flip Chip Embedded PCB Power Module with Double Sided Cooling and Low Parasitic Inductance for Fine Pad Power Devices." 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), 2026 International Conference on, 2026, p. 349, https://doi.org/10.23919/ICEP-HBS69241.2026.11550466.