Academic Journal
Investigation of Diffusion Bonding and Thermal Conductivity in HTS Coils Under Varying Winding Tensions
| Title: | Investigation of Diffusion Bonding and Thermal Conductivity in HTS Coils Under Varying Winding Tensions |
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| Authors: | Kim, J., Kim, S., Kim, G., Ha, H. |
| Source: | IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 36(5):1-5 Aug, 2026 |
| Database: | IEEE Xplore Digital Library |
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