Kim, J., Kim, S., Kim, G., & Ha, H. (2026). Investigation of Diffusion Bonding and Thermal Conductivity in HTS Coils Under Varying Winding Tensions. IEEE Transactions on Applied Superconductivity, Applied Superconductivity, IEEE Transactions on, IEEE Trans. Appl. Supercond., 36(5), 1. https://doi.org/10.1109/TASC.2026.3673762
Παραπομπή σε μορφή Chicago (17η εκδ.)Kim, J., S. Kim, G. Kim, και H. Ha. "Investigation of Diffusion Bonding and Thermal Conductivity in HTS Coils Under Varying Winding Tensions." IEEE Transactions on Applied Superconductivity, Applied Superconductivity, IEEE Transactions on, IEEE Trans. Appl. Supercond. 36, no. 5 (2026): 1. https://doi.org/10.1109/TASC.2026.3673762.
Παραπομπή σε μορφή MLA (9th εκδ.)Kim, J., et al. "Investigation of Diffusion Bonding and Thermal Conductivity in HTS Coils Under Varying Winding Tensions." IEEE Transactions on Applied Superconductivity, Applied Superconductivity, IEEE Transactions on, IEEE Trans. Appl. Supercond., vol. 36, no. 5, 2026, p. 1, https://doi.org/10.1109/TASC.2026.3673762.