Conference
Finite Element Simulation Based Thermal Field Analysis of Power Modules Combine with Heatsink Thermal Network Models
| Title: | Finite Element Simulation Based Thermal Field Analysis of Power Modules Combine with Heatsink Thermal Network Models |
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| Authors: | Zhuo, Jianghua, Xie, Jingnan, Zhang, Ximing, Zheng, Yangjun, Yang, Huan, Luo, Haoze |
| Source: | 2025 IEEE 3rd International Power Electronics and Application Symposium (PEAS) Power Electronics and Application Symposium (PEAS), 2025 IEEE 3rd International. :362-367 Nov, 2025 |
| Relation: | 2025 IEEE 3rd International Power Electronics and Application Symposium (PEAS) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9798331539115 9798331539108 9798331539122 |
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| DOI: | 10.1109/PEAS66638.2025.11403478 |