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Finite Element Simulation Based Thermal Field Analysis of Power Modules Combine with Heatsink Thermal Network Models

Bibliographic Details
Title: Finite Element Simulation Based Thermal Field Analysis of Power Modules Combine with Heatsink Thermal Network Models
Authors: Zhuo, Jianghua, Xie, Jingnan, Zhang, Ximing, Zheng, Yangjun, Yang, Huan, Luo, Haoze
Source: 2025 IEEE 3rd International Power Electronics and Application Symposium (PEAS) Power Electronics and Application Symposium (PEAS), 2025 IEEE 3rd International. :362-367 Nov, 2025
Relation: 2025 IEEE 3rd International Power Electronics and Application Symposium (PEAS)
Database: IEEE Xplore Digital Library
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Header DbId: edseee
DbLabel: IEEE Xplore Digital Library
An: edseee.11403478
RelevancyScore: 1129
AccessLevel: 2
PubType: Conference
PubTypeId: conference
PreciseRelevancyScore: 1129.439453125
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Finite Element Simulation Based Thermal Field Analysis of Power Modules Combine with Heatsink Thermal Network Models
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Zhuo%2C+Jianghua%22">Zhuo, Jianghua</searchLink><br /><searchLink fieldCode="AR" term="%22Xie%2C+Jingnan%22">Xie, Jingnan</searchLink><br /><searchLink fieldCode="AR" term="%22Zhang%2C+Ximing%22">Zhang, Ximing</searchLink><br /><searchLink fieldCode="AR" term="%22Zheng%2C+Yangjun%22">Zheng, Yangjun</searchLink><br /><searchLink fieldCode="AR" term="%22Yang%2C+Huan%22">Yang, Huan</searchLink><br /><searchLink fieldCode="AR" term="%22Luo%2C+Haoze%22">Luo, Haoze</searchLink>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: 2025 IEEE 3rd International Power Electronics and Application Symposium (PEAS) Power Electronics and Application Symposium (PEAS), 2025 IEEE 3rd International. :362-367 Nov, 2025
– Name: NoteTitleSource
  Label: Relation
  Group: SrcInfo
  Data: 2025 IEEE 3rd International Power Electronics and Application Symposium (PEAS)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edseee&AN=edseee.11403478
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1109/PEAS66638.2025.11403478
    PhysicalDescription:
      Pagination:
        PageCount: 6
        StartPage: 362
    Titles:
      – TitleFull: Finite Element Simulation Based Thermal Field Analysis of Power Modules Combine with Heatsink Thermal Network Models
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Zhuo, Jianghua
      – PersonEntity:
          Name:
            NameFull: Xie, Jingnan
      – PersonEntity:
          Name:
            NameFull: Zhang, Ximing
      – PersonEntity:
          Name:
            NameFull: Zheng, Yangjun
      – PersonEntity:
          Name:
            NameFull: Yang, Huan
      – PersonEntity:
          Name:
            NameFull: Luo, Haoze
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 07
              M: 11
              Type: published
              Y: 2025
          Identifiers:
            – Type: isbn-print
              Value: 9798331539115
            – Type: isbn-print
              Value: 9798331539108
            – Type: isbn-print
              Value: 9798331539122
            – Type: issn-locals
              Value: edseee.IEEEConferenc
          Titles:
            – TitleFull: 2025 IEEE 3rd International Power Electronics and Application Symposium (PEAS), Power Electronics and Application Symposium (PEAS), 2025 IEEE 3rd International
              Type: main
ResultId 1