Zhuo, J., Xie, J., Zhang, X., Zheng, Y., Yang, H., & Luo, H. (2025). Finite Element Simulation Based Thermal Field Analysis of Power Modules Combine with Heatsink Thermal Network Models. 2025 IEEE 3rd International Power Electronics and Application Symposium (PEAS), Power Electronics and Application Symposium (PEAS), 2025 IEEE 3rd International, 362. https://doi.org/10.1109/PEAS66638.2025.11403478
Παραπομπή σε μορφή Chicago (17η εκδ.)Zhuo, Jianghua, Jingnan Xie, Ximing Zhang, Yangjun Zheng, Huan Yang, και Haoze Luo. "Finite Element Simulation Based Thermal Field Analysis of Power Modules Combine with Heatsink Thermal Network Models." 2025 IEEE 3rd International Power Electronics and Application Symposium (PEAS), Power Electronics and Application Symposium (PEAS), 2025 IEEE 3rd International 2025: 362. https://doi.org/10.1109/PEAS66638.2025.11403478.
Παραπομπή σε μορφή MLA (9th εκδ.)Zhuo, Jianghua, et al. "Finite Element Simulation Based Thermal Field Analysis of Power Modules Combine with Heatsink Thermal Network Models." 2025 IEEE 3rd International Power Electronics and Application Symposium (PEAS), Power Electronics and Application Symposium (PEAS), 2025 IEEE 3rd International, 2025, p. 362, https://doi.org/10.1109/PEAS66638.2025.11403478.