Academic Journal
Accurate Extraction Method for Thermal Resistance of Press-Pack Devices Based on Structural Function
| Τίτλος: | Accurate Extraction Method for Thermal Resistance of Press-Pack Devices Based on Structural Function |
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| Συγγραφείς: | Liu, J., Wei, X., Tang, X., Wang, J., Wang, L., Du, Y. |
| Πηγή: | IEEE Journal of Emerging and Selected Topics in Power Electronics IEEE J. Emerg. Sel. Topics Power Electron. Emerging and Selected Topics in Power Electronics, IEEE Journal of. 14(4):4735-4746 Aug, 2026 |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| FullText | Text: Availability: 0 CustomLinks: – Url: https://resolver.ebsco.com/c/fiv2js/result?sid=EBSCO:edseee&genre=article&issn=21686777&ISBN=&volume=14&issue=4&date=20260801&spage=4735&pages=4735-4746&title=IEEE Journal of Emerging and Selected Topics in Power Electronics, Emerging and Selected Topics in Power Electronics, IEEE Journal of, IEEE J. Emerg. Sel. Topics Power Electron.&atitle=Accurate%20Extraction%20Method%20for%20Thermal%20Resistance%20of%20Press-Pack%20Devices%20Based%20on%20Structural%20Function&aulast=Liu%2C%20J.&id=DOI:10.1109/JESTPE.2026.3654672 Name: Full Text Finder (for New FTF UI) (ns324271) Category: fullText Text: Full Text Finder MouseOverText: Full Text Finder |
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| Items | – Name: Title Label: Title Group: Ti Data: Accurate Extraction Method for Thermal Resistance of Press-Pack Devices Based on Structural Function – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Liu%2C+J%2E%22">Liu, J.</searchLink><br /><searchLink fieldCode="AR" term="%22Wei%2C+X%2E%22">Wei, X.</searchLink><br /><searchLink fieldCode="AR" term="%22Tang%2C+X%2E%22">Tang, X.</searchLink><br /><searchLink fieldCode="AR" term="%22Wang%2C+J%2E%22">Wang, J.</searchLink><br /><searchLink fieldCode="AR" term="%22Wang%2C+L%2E%22">Wang, L.</searchLink><br /><searchLink fieldCode="AR" term="%22Du%2C+Y%2E%22">Du, Y.</searchLink> – Name: TitleSource Label: Source Group: Src Data: IEEE Journal of Emerging and Selected Topics in Power Electronics IEEE J. Emerg. Sel. Topics Power Electron. Emerging and Selected Topics in Power Electronics, IEEE Journal of. 14(4):4735-4746 Aug, 2026 |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/JESTPE.2026.3654672 PhysicalDescription: Pagination: PageCount: 12 StartPage: 4735 Titles: – TitleFull: Accurate Extraction Method for Thermal Resistance of Press-Pack Devices Based on Structural Function Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Liu, J. – PersonEntity: Name: NameFull: Wei, X. – PersonEntity: Name: NameFull: Tang, X. – PersonEntity: Name: NameFull: Wang, J. – PersonEntity: Name: NameFull: Wang, L. – PersonEntity: Name: NameFull: Du, Y. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 08 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 21686777 – Type: issn-print Value: 21686785 – Type: issn-locals Value: edseee.IEEEJournals Numbering: – Type: volume Value: 14 – Type: issue Value: 4 Titles: – TitleFull: IEEE Journal of Emerging and Selected Topics in Power Electronics, Emerging and Selected Topics in Power Electronics, IEEE Journal of, IEEE J. Emerg. Sel. Topics Power Electron. Type: main |
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