Liu, J., Wei, X., Tang, X., Wang, J., Wang, L., & Du, Y. (2026). Accurate Extraction Method for Thermal Resistance of Press-Pack Devices Based on Structural Function. IEEE Journal of Emerging and Selected Topics in Power Electronics, Emerging and Selected Topics in Power Electronics, IEEE Journal of, IEEE J. Emerg. Sel. Topics Power Electron., 14(4), 4735-4746. https://doi.org/10.1109/JESTPE.2026.3654672
Παραπομπή σε μορφή Chicago (17η εκδ.)Liu, J., X. Wei, X. Tang, J. Wang, L. Wang, και Y. Du. "Accurate Extraction Method for Thermal Resistance of Press-Pack Devices Based on Structural Function." IEEE Journal of Emerging and Selected Topics in Power Electronics, Emerging and Selected Topics in Power Electronics, IEEE Journal of, IEEE J. Emerg. Sel. Topics Power Electron. 14, no. 4 (2026): 4735-4746. https://doi.org/10.1109/JESTPE.2026.3654672.
Παραπομπή σε μορφή MLA (9th εκδ.)Liu, J., et al. "Accurate Extraction Method for Thermal Resistance of Press-Pack Devices Based on Structural Function." IEEE Journal of Emerging and Selected Topics in Power Electronics, Emerging and Selected Topics in Power Electronics, IEEE Journal of, IEEE J. Emerg. Sel. Topics Power Electron., vol. 14, no. 4, 2026, pp. 4735-4746, https://doi.org/10.1109/JESTPE.2026.3654672.