Academic Journal
A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based on Copper Substrate Temperature Field Reconstruction
| Title: | A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based on Copper Substrate Temperature Field Reconstruction |
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| Authors: | Du, X., Yang, Y., Lv, J., Wen, Y., Zou, S., Wang, Y., Cobreces, S. |
| Source: | IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 41(4):4498-4504 Apr, 2026 |
| Database: | IEEE Xplore Digital Library |
| ISSN: | 08858993 19410107 |
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| DOI: | 10.1109/TPEL.2025.3629744 |