Academic Journal
A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based on Copper Substrate Temperature Field Reconstruction
| Title: | A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based on Copper Substrate Temperature Field Reconstruction |
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| Authors: | Du, X., Yang, Y., Lv, J., Wen, Y., Zou, S., Wang, Y., Cobreces, S. |
| Source: | IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 41(4):4498-4504 Apr, 2026 |
| Database: | IEEE Xplore Digital Library |
| FullText | Text: Availability: 0 CustomLinks: – Url: https://resolver.ebsco.com/c/fiv2js/result?sid=EBSCO:edseee&genre=article&issn=08858993&ISBN=&volume=41&issue=4&date=20260401&spage=4498&pages=4498-4504&title=IEEE Transactions on Power Electronics, Power Electronics, IEEE Transactions on, IEEE Trans. Power Electron.&atitle=A%20Fast%20and%20Intelligent%20Monitoring%20of%20Solder%20Layer%20Degradation%20in%20Multichip%20IGBT%20Modules%20Based%20on%20Copper%20Substrate%20Temperature%20Field%20Reconstruction&aulast=Du%2C%20X.&id=DOI:10.1109/TPEL.2025.3629744 Name: Full Text Finder (for New FTF UI) (ns324271) Category: fullText Text: Full Text Finder MouseOverText: Full Text Finder |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/TPEL.2025.3629744 PhysicalDescription: Pagination: PageCount: 7 StartPage: 4498 Titles: – TitleFull: A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based on Copper Substrate Temperature Field Reconstruction Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Du, X. – PersonEntity: Name: NameFull: Yang, Y. – PersonEntity: Name: NameFull: Lv, J. – PersonEntity: Name: NameFull: Wen, Y. – PersonEntity: Name: NameFull: Zou, S. – PersonEntity: Name: NameFull: Wang, Y. – PersonEntity: Name: NameFull: Cobreces, S. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 04 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 08858993 – Type: issn-print Value: 19410107 – Type: issn-locals Value: edseee.IEEEJournals Numbering: – Type: volume Value: 41 – Type: issue Value: 4 Titles: – TitleFull: IEEE Transactions on Power Electronics, Power Electronics, IEEE Transactions on, IEEE Trans. Power Electron. Type: main |
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