Du, X., Yang, Y., Lv, J., Wen, Y., Zou, S., Wang, Y., & Cobreces, S. (2026). A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based on Copper Substrate Temperature Field Reconstruction. IEEE Transactions on Power Electronics, Power Electronics, IEEE Transactions on, IEEE Trans. Power Electron., 41(4), 4498-4504. https://doi.org/10.1109/TPEL.2025.3629744
Παραπομπή σε μορφή Chicago (17η εκδ.)Du, X., Y. Yang, J. Lv, Y. Wen, S. Zou, Y. Wang, και S. Cobreces. "A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based on Copper Substrate Temperature Field Reconstruction." IEEE Transactions on Power Electronics, Power Electronics, IEEE Transactions on, IEEE Trans. Power Electron. 41, no. 4 (2026): 4498-4504. https://doi.org/10.1109/TPEL.2025.3629744.
Παραπομπή σε μορφή MLA (9th εκδ.)Du, X., et al. "A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based on Copper Substrate Temperature Field Reconstruction." IEEE Transactions on Power Electronics, Power Electronics, IEEE Transactions on, IEEE Trans. Power Electron., vol. 41, no. 4, 2026, pp. 4498-4504, https://doi.org/10.1109/TPEL.2025.3629744.