Park, I., Kim, G., Kim, J., & Ha, H. (2026). Real-Time Thickness Monitoring for Enhanced Geometric Uniformity of REBCO CCs. IEEE Transactions on Applied Superconductivity, Applied Superconductivity, IEEE Transactions on, IEEE Trans. Appl. Supercond., 36(3), 1. https://doi.org/10.1109/TASC.2025.3629593
Παραπομπή σε μορφή Chicago (17η εκδ.)Park, I., G. Kim, J. Kim, και H. Ha. "Real-Time Thickness Monitoring for Enhanced Geometric Uniformity of REBCO CCs." IEEE Transactions on Applied Superconductivity, Applied Superconductivity, IEEE Transactions on, IEEE Trans. Appl. Supercond. 36, no. 3 (2026): 1. https://doi.org/10.1109/TASC.2025.3629593.
Παραπομπή σε μορφή MLA (9th εκδ.)Park, I., et al. "Real-Time Thickness Monitoring for Enhanced Geometric Uniformity of REBCO CCs." IEEE Transactions on Applied Superconductivity, Applied Superconductivity, IEEE Transactions on, IEEE Trans. Appl. Supercond., vol. 36, no. 3, 2026, p. 1, https://doi.org/10.1109/TASC.2025.3629593.