Conference
Warpage Reduction of Laminate Substrates Through Metamodel-Based Optimization of Material Properties
| Τίτλος: | Warpage Reduction of Laminate Substrates Through Metamodel-Based Optimization of Material Properties |
|---|---|
| Συγγραφείς: | Porathur, F., Huber, F., Stadler, E., Fuchs, P., Gruber, D.P. |
| Πηγή: | 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European. :1-7 Sep, 2025 |
| Relation: | 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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