Conference
Προβολή σε EDS

Warpage Reduction of Laminate Substrates Through Metamodel-Based Optimization of Material Properties

Λεπτομέρειες βιβλιογραφικής εγγραφής
Τίτλος: Warpage Reduction of Laminate Substrates Through Metamodel-Based Optimization of Material Properties
Συγγραφείς: Porathur, F., Huber, F., Stadler, E., Fuchs, P., Gruber, D.P.
Πηγή: 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European. :1-7 Sep, 2025
Relation: 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Βάση Δεδομένων: IEEE Xplore Digital Library
FullText Text:
  Availability: 0
Header DbId: edseee
DbLabel: IEEE Xplore Digital Library
An: edseee.11222550
RelevancyScore: 1117
AccessLevel: 2
PubType: Conference
PubTypeId: conference
PreciseRelevancyScore: 1116.8154296875
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Warpage Reduction of Laminate Substrates Through Metamodel-Based Optimization of Material Properties
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Porathur%2C+F%2E%22">Porathur, F.</searchLink><br /><searchLink fieldCode="AR" term="%22Huber%2C+F%2E%22">Huber, F.</searchLink><br /><searchLink fieldCode="AR" term="%22Stadler%2C+E%2E%22">Stadler, E.</searchLink><br /><searchLink fieldCode="AR" term="%22Fuchs%2C+P%2E%22">Fuchs, P.</searchLink><br /><searchLink fieldCode="AR" term="%22Gruber%2C+D%2EP%2E%22">Gruber, D.P.</searchLink>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European. :1-7 Sep, 2025
– Name: NoteTitleSource
  Label: Relation
  Group: SrcInfo
  Data: 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edseee&AN=edseee.11222550
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.23919/EMPC63132.2025.11222550
    PhysicalDescription:
      Pagination:
        PageCount: 7
        StartPage: 1
    Titles:
      – TitleFull: Warpage Reduction of Laminate Substrates Through Metamodel-Based Optimization of Material Properties
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Porathur, F.
      – PersonEntity:
          Name:
            NameFull: Huber, F.
      – PersonEntity:
          Name:
            NameFull: Stadler, E.
      – PersonEntity:
          Name:
            NameFull: Fuchs, P.
      – PersonEntity:
          Name:
            NameFull: Gruber, D.P.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 15
              M: 09
              Type: published
              Y: 2025
          Identifiers:
            – Type: isbn-print
              Value: 9781739500511
            – Type: issn-locals
              Value: edseee.IEEEConferenc
          Titles:
            – TitleFull: 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC), Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European
              Type: main
ResultId 1