Λεπτομέρειες βιβλιογραφικής εγγραφής
| Τίτλος: |
Warpage Reduction of Laminate Substrates Through Metamodel-Based Optimization of Material Properties |
| Συγγραφείς: |
Porathur, F., Huber, F., Stadler, E., Fuchs, P., Gruber, D.P. |
| Πηγή: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European. :1-7 Sep, 2025 |
| Relation: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| Βάση Δεδομένων: |
IEEE Xplore Digital Library |