Porathur, F., Huber, F., Stadler, E., Fuchs, P., & Gruber, D. (2025). Warpage Reduction of Laminate Substrates Through Metamodel-Based Optimization of Material Properties. 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC), Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European, 1. https://doi.org/10.23919/EMPC63132.2025.11222550
Παραπομπή σε μορφή Chicago (17η εκδ.)Porathur, F., F. Huber, E. Stadler, P. Fuchs, και D.P Gruber. "Warpage Reduction of Laminate Substrates Through Metamodel-Based Optimization of Material Properties." 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC), Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European 2025: 1. https://doi.org/10.23919/EMPC63132.2025.11222550.
Παραπομπή σε μορφή MLA (9th εκδ.)Porathur, F., et al. "Warpage Reduction of Laminate Substrates Through Metamodel-Based Optimization of Material Properties." 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC), Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European, 2025, p. 1, https://doi.org/10.23919/EMPC63132.2025.11222550.