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Low-Frequency EMI Prediction by Electromagnetic FEA and Machine Learning in Consumer Electronics Devices with PCBs

Bibliographic Details
Title: Low-Frequency EMI Prediction by Electromagnetic FEA and Machine Learning in Consumer Electronics Devices with PCBs
Authors: Liang, Jingchen, Han, Peng, Gottipati, Pavani
Source: 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), 2025 IEEE International Symposium on. :499-504 Aug, 2025
Relation: 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)
Database: IEEE Xplore Digital Library
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  Data: <searchLink fieldCode="AR" term="%22Liang%2C+Jingchen%22">Liang, Jingchen</searchLink><br /><searchLink fieldCode="AR" term="%22Han%2C+Peng%22">Han, Peng</searchLink><br /><searchLink fieldCode="AR" term="%22Gottipati%2C+Pavani%22">Gottipati, Pavani</searchLink>
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  Data: 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), 2025 IEEE International Symposium on. :499-504 Aug, 2025
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  Data: 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)
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RecordInfo BibRecord:
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        Value: 10.1109/EMCSIPI52291.2025.11169820
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      – TitleFull: Low-Frequency EMI Prediction by Electromagnetic FEA and Machine Learning in Consumer Electronics Devices with PCBs
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            NameFull: Liang, Jingchen
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            NameFull: Han, Peng
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            NameFull: Gottipati, Pavani
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              M: 08
              Type: published
              Y: 2025
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            – TitleFull: 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), 2025 IEEE International Symposium on
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