Bibliographic Details
| Title: |
Hetero-Integration of InP Chiplets on a 300 mm RF Silicon Interposer for mm-Wave Applications |
| Authors: |
Sinha, S., Jafarpourchekab, H., Pinho, N., Leech, D., Kennes, K., Chancerel, F., Uruena, A., Shafahian, E., Lofrano, M., Miller, A., Beyne, E., Collaert, N., Sun, X. |
| Source: |
2024 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2024 IEEE International. :1-4 Dec, 2024 |
| Relation: |
2024 IEEE International Electron Devices Meeting (IEDM) |
| Database: |
IEEE Xplore Digital Library |