Chen, M., Fan, L., Mao, Y., Zhu, Z., Wang, Y., & Yin, Y. (2024). Surface Potential Measurement of Power Module Packaging Insulation based on Electrostatic Observation. 2024 3rd International Conference on Energy, Power and Electrical Technology (ICEPET), Energy, Power and Electrical Technology (ICEPET), 2024 3rd International Conference on, 1119. https://doi.org/10.1109/ICEPET61938.2024.10626051
Chicago Style (17th ed.) CitationChen, Meng, Lu Fan, Yingke Mao, Zhengyi Zhu, Yalin Wang, and Yi Yin. "Surface Potential Measurement of Power Module Packaging Insulation Based on Electrostatic Observation." 2024 3rd International Conference on Energy, Power and Electrical Technology (ICEPET), Energy, Power and Electrical Technology (ICEPET), 2024 3rd International Conference on 2024: 1119. https://doi.org/10.1109/ICEPET61938.2024.10626051.
MLA (9th ed.) CitationChen, Meng, et al. "Surface Potential Measurement of Power Module Packaging Insulation Based on Electrostatic Observation." 2024 3rd International Conference on Energy, Power and Electrical Technology (ICEPET), Energy, Power and Electrical Technology (ICEPET), 2024 3rd International Conference on, 2024, p. 1119, https://doi.org/10.1109/ICEPET61938.2024.10626051.