Academic Journal
Prediction of Crack Initiation at Die Corner of Molded Underfill Flip-Chip Packages Under Thermal Load by New Criteria
| Τίτλος: | Prediction of Crack Initiation at Die Corner of Molded Underfill Flip-Chip Packages Under Thermal Load by New Criteria |
|---|---|
| Συγγραφείς: | Lyu, G.C., Zhang, X.P., Zhou, M.B., Ke, C.B., Mai, Y.W. |
| Πηγή: | IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 24(4):498-506 Dec, 2024 |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
καταχωρήστε σχόλιο πρώτοι!