Lyu, G., Zhang, X., Zhou, M., Ke, C., & Mai, Y. (2024). Prediction of Crack Initiation at Die Corner of Molded Underfill Flip-Chip Packages Under Thermal Load by New Criteria. IEEE Transactions on Device and Materials Reliability, Device and Materials Reliability, IEEE Transactions on, IEEE Trans. Device Mater. Relib., 24(4), 498. https://doi.org/10.1109/TDMR.2024.3420759
Παραπομπή σε μορφή Chicago (17η εκδ.)Lyu, G.C, X.P Zhang, M.B Zhou, C.B Ke, και Y.W Mai. "Prediction of Crack Initiation at Die Corner of Molded Underfill Flip-Chip Packages Under Thermal Load by New Criteria." IEEE Transactions on Device and Materials Reliability, Device and Materials Reliability, IEEE Transactions on, IEEE Trans. Device Mater. Relib. 24, no. 4 (2024): 498. https://doi.org/10.1109/TDMR.2024.3420759.
Παραπομπή σε μορφή MLA (9th εκδ.)Lyu, G.C, et al. "Prediction of Crack Initiation at Die Corner of Molded Underfill Flip-Chip Packages Under Thermal Load by New Criteria." IEEE Transactions on Device and Materials Reliability, Device and Materials Reliability, IEEE Transactions on, IEEE Trans. Device Mater. Relib., vol. 24, no. 4, 2024, p. 498, https://doi.org/10.1109/TDMR.2024.3420759.