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1Conference
Authors: Li, Yuran, Wu, Di, Jenkin, Michael, Zinflou, Arnaud, Boulet, Benoit
Source: 2025 IEEE Electrical Power and Energy Conference (EPEC) Electrical Power and Energy Conference (EPEC), 2025 IEEE. :182-188 Oct, 2025
Relation: 2025 IEEE Electrical Power and Energy Conference (EPEC)
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2Book
Source: Structural Health Monitoring, Damage Detection & Mechatronics, 2016. May 09, 2025
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3Conference
Authors: Cinar, Ahmet Cevahir, Nur Erman, Kadriye
Source: 2024 5th International Conference on Communications, Information, Electronic and Energy Systems (CIEES) Communications, Information, Electronic and Energy Systems (CIEES), 2024 5th International Conference on. :1-4 Nov, 2024
Relation: 2024 5th International Conference on Communications, Information, Electronic and Energy Systems (CIEES)
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4Academic Journal
Authors: Al-Nahhal, M., Al-Nahhal, I., Soman, S.K.O., Dobre, O.A.
Source: IEEE Open Journal of the Communications Society IEEE Open J. Commun. Soc. Communications Society, IEEE Open Journal of the. 6:5552-5567 2025
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5Conference
Authors: Kim, Tae-Yun, Hwang, Suk-Seung
Source: 2023 Fourteenth International Conference on Ubiquitous and Future Networks (ICUFN) Ubiquitous and Future Networks (ICUFN), 2023 Fourteenth International Conference on. :849-852 Jul, 2023
Relation: 2023 Fourteenth International Conference on Ubiquitous and Future Networks (ICUFN)
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6Academic Journal
Authors: Al-Nahhal, M., Al-Nahhal, I., Dobre, O.A., Soman, S.K.O.
Source: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 42(6):1941-1954 Mar, 2024
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7Conference
Source: 2021 International Conference on Visual Communications and Image Processing (VCIP) Visual Communications and Image Processing (VCIP), 2021 International Conference on. :1-5 Dec, 2021
Relation: 2021 International Conference on Visual Communications and Image Processing (VCIP)
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8Academic Journal
Authors: Sim, K.M.
Source: IEEE Transactions on Computational Social Systems IEEE Trans. Comput. Soc. Syst. Computational Social Systems, IEEE Transactions on. 9(4):1112-1121 Aug, 2022
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9Academic Journal
Authors: Shahidian, Nika, Abreu, Paulo ⁎, Santos, Daniel, Barbosa-Povoa, Ana
Linked Full TextSource: In Computers & Industrial Engineering February 2025 200
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10Academic Journal
Source: IEEE Transactions on Sustainable Energy IEEE Trans. Sustain. Energy Sustainable Energy, IEEE Transactions on. 11(1):337-349 Jan, 2020
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11Academic Journal
Authors: Tae-yun Kim, Hua Lee, Suk-seung Hwang
Source: ICT Express, Vol 8, Iss 4, Pp 539-543 (2022)
Subject Terms: Computational complexity analysis, Cascade estimation, 0202 electrical engineering, electronic engineering, information engineering, Information technology, 02 engineering and technology, Combined array antenna, T58.5-58.64, AOA estimation
Linked Full TextAccess URL: https://doaj.org/article/43e3770d12f1435faf3b921cbc243a6f
https://www.sciencedirect.com/science/article/pii/S2405959521001521 -
12Conference
Authors: Chen, T., Mazomenos, E., Maharatna, K., Dasmahapatra, S., Niranjan, M.
Source: 2012 IEEE Workshop on Signal Processing Systems Signal Processing Systems (SiPS), 2012 IEEE Workshop on. :37-42 Oct, 2012
Relation: 2012 IEEE Workshop on Signal Processing Systems (SiPS)
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13eBook
Contributors: Górecki, Krzysztof, Górecki, Paweł
Subject Terms: Dual-Phase-Lag heat transfer model, thermal simulation algorithm, thermal measurements, Finite Difference Method scheme, Grünwald–Letnikov fractional derivative, Krylov subspace-based model order reduction, algorithm efficiency analysis, relative error analysis, algorithm convergence analysis, computational complexity analysis, finite difference method scheme, BJT, modelling, self-heating, silicon carbide, SPICE, IGBT, DC–DC converter, electrothermal model, averaged model, thermal phenomena, diode–transistor switch, power electronics, multi-LED lighting modules, device thermal coupling, compact thermal models, temperature sensors, microprocessor, throughput improvement, inductors, ferromagnetic cores, thermal model, transient thermal impedance, thermal resistance, electrothermal (ET) simulation, finite-element method (FEM), model-order reduction (MOR), multicellular power MOSFET, silicon carbide (SiC), History of engineering and technology
File Description: application/octet-stream
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14Conference
Authors: Hanlei Zhang, Mo-Yuen Chow
Source: IEEE PES General Meeting Power and Energy Society General Meeting, 2010 IEEE. :1-6 Jul, 2010
Relation: 2010 IEEE Power & Energy Society General Meeting
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15Academic Journal
Authors: Chen, T., Mazomenos, E. B., Maharatna, K., Dasmahapatra, S., Niranjan, M.
Source: IEEE Journal on Emerging and Selected Topics in Circuits and Systems IEEE J. Emerg. Sel. Topics Circuits Syst. Emerging and Selected Topics in Circuits and Systems, IEEE Journal on. 3(1):75-85 Mar, 2013
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16Academic Journal
Authors: Li, K., Peng, J.-X., Bai, E.-W.
Source: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 56(3):630-643 Mar, 2009
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17Academic Journal
Authors: Haiyang Xu, Hengyou Lan
Source: Electronics, Vol 12, Iss 7, p 1681 (2023)
Subject Terms: computational complexity analysis, high parallelizability, improved genetic algorithm, adaptive layered clustering framework, large-scale traveling salesman problem, Electronics, TK7800-8360
Relation: https://www.mdpi.com/2079-9292/12/7/1681; https://doaj.org/toc/2079-9292; https://doaj.org/article/d618355bb303458abd8801badd696da0
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18Academic Journal
Authors: Xiao Wang, Mei Liu, Peisi Zhong, Chao Zhang, Dawei Zhang
Source: Sustainability, Vol 15, Iss 13785, p 13785 (2023)
Subject Terms: assembly manufacturing system, production scheduling, assembly sequence planning, discrete assembly time and arrival time control, computational complexity analysis, Environmental effects of industries and plants, TD194-195, Renewable energy sources, TJ807-830, Environmental sciences, GE1-350
Relation: https://www.mdpi.com/2071-1050/15/18/13785; https://doaj.org/toc/2071-1050; https://doaj.org/article/a100fd981a864466bfd0c4b77268cad8
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19Academic Journal
Authors: Jian-Xun Peng, Kang Li, De-Shuang Huang
Source: IEEE Transactions on Neural Networks IEEE Trans. Neural Netw. Neural Networks, IEEE Transactions on. 17(6):1439-1451 Nov, 2006
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20Academic Journal
Authors: Beeharry, Y.Aff1, IDs1127702108106x_cor1, Fowdur, T. P., Soyjaudah, K. M. S.
Linked Full TextSource: Wireless Personal Communications: An International Journal. :1-29