Optimization of Bismuth Ferrite Sputtering Targets: Comparative Study of La-Doping and Two-Step Sintering on Structural and Dimensional Stability

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Πηγή: 2026 40th Symposium on Microelectronics Technology and Devices (SBMicro) Microelectronics Technology and Devices (SBMicro), 2026 40th Symposium on. :1-4 Aug, 2026

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Region Transfer-Driven Robust Multiobjective Operational Optimization for Sintering

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Πηγή: 2026 18th International Conference on Advanced Computational Intelligence (ICACI) Advanced Computational Intelligence (ICACI), 2026 18th International Conference on. :259-266 Aug, 2026

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Copper Nano-Sintering Paste for Die Attach and Via Filling Based on a Self-Assembly Mechanism

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Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-8 Aug, 2026

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From Silver to Copper: An All-Sintered-Cu Interconnection for SiC Power Modules

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Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-4 Aug, 2026

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A Process Window Study of Pressure-Assisted Copper Paste Sintering for Die-Attach Applications

Συγγραφείς: Zong, Qihang, Wang, Xiaowei, Lin, Jieming, Zhang, Xiaowei, Yu, Gongchi, Guo, Jinhu, Ye, Huaiyu

Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026

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Pressureless Sintering of Ag Paste on Cu Interface in N2 Atmosphere Assisted by Silver Acetate

Συγγραφείς: Huang, Jinshun, Huang, Qiuyan, Cen, Wei, Xu, Yaohua, Jiang, Han, Li, Junjie

Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-6 Aug, 2026

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Research on Sintering Performance Optimization of Large-Area Cu Sintering for Press-Pack IGBT Packaging

Συγγραφείς: Zhang, Zhiyuan, Liang, Lin, Wang, Yizhu, Tu, Liuyu, Wang, Ke

Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026

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Enhanced Low-Temperature Cu–Cu Bonding with Mixed-Size Cu Nanowire Arrays

Συγγραφείς: Wang, Guanghao, Li, Susu, Xu, Yaohua, Wang, Yi, Jiang, Han

Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-4 Aug, 2026

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Superb sinterability of the Cu paste consisting of Cu micro-nano particles synthesized by a mild one-pot aqueous method for low-temperature in-air die attachment

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Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026

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Pressure Cu Sintering Paste Developed for Next Generation Interconnection Material

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Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026

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Effect of Polyethylene Glycol Molecular Weight on the Die-Attach Performance of Pressureless Silver Sintering Paste

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Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026

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Application of Dual-Side Silver Sintering Technology in 6-Inch IGCT Devices

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Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-7 Aug, 2026

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Size-Dependent Sintering Behavior of Cu Nanoparticles: A Molecular Dynamics Simulation

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Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-4 Aug, 2026

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Rapid Low-temperature Sintering of Cu Microparticles with PEG via a Pre-Drying Process

Συγγραφείς: Jiang, Wenpeng, Yin, Dongxian, Yu, Zibo, Ouyang, Yuzhi, Yan, Haidong, He, Siliang

Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026

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A New Method for Preparing Low-Temperature Copper Paste via Powder Pre-Deformation

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Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026

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Optimization and Reliability Investigation of Nano-Copper Sintering Technology for SiC MOSFET Devices

Συγγραφείς: Yang, Lei, Qian, Jing, Wu, Lingmei, Huang, Yexiong, Chen, Xianping

Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-6 Aug, 2026

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One-Pot Aqueous-Synthesized Submicron Cu Particles Enabling Air-Sinterable Paste for Wide-Bandgap Die Attachment

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Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-4 Aug, 2026

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Advanced Cold-Sintered Phosphor Ceramics@Cu Converters toward Ultra-High-Brightness Laser Lighting

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Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026

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Sintering Molecular Dynamic Behaviors of Cu-Ag Nanoparticles with Different Architectures for Power Electronic Interconnection Packaging

Συγγραφείς: Cao, Yuhao, Wang, Xinyuan, Huang, Yiqian, Chen, Siyu, Liu, Ruijie, Mou, Yun, Xu, Jianming

Πηγή: 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026

Relation: 2026 27th International Conference on Electronic Packaging Technology (ICEPT)

3D printing of aluminum alloys under different extrusion techniques

Συγγραφείς: Al Zeyadi, Noora Talib Mohammed

Συνεισφορές: University/Department: Universitat Politècnica de Catalunya. Departament de Ciència i Enginyeria de Materials

Thesis Advisors: Cabrera Marrero, José M., Fenollosa i Artés, Felip

Πηγή: TDX (Tesis Doctorals en Xarxa)

Θεματικοί όροι: FDM, screw-based extrusion, DIW, thermal debinding, sintering, Àrees temàtiques de la UPC::Enginyeria dels materials, 620 - Assaig de materials. Material comercials. Economia de l'energia

Περιγραφή αρχείου: application/pdf

Σύνδεσμος πρόσβασης: http://hdl.handle.net/10803/695825
https://dx.doi.org/10.5821/dissertation-2117-446580