SMT-Based Automated Verification for Financial Transaction Document Consistency

Authors: Larasaty, Raditha, Murwantara, I Made

Source: 2026 3rd International Conference on Technology Innovation and Its Applications (ICTIIA) Technology Innovation and Its Applications (ICTIIA), 2026 3rd International Conference on. :1-6 Sep, 2026

Relation: 2026 3rd International Conference on Technology Innovation and Its Applications (ICTIIA)

A Structured Conceptual Framework for Predictive Maintenance on an SMT Assembly Line: Failure Modes, Sensor Mapping, and Algorithm Selection

Authors: Jara, Tomas, Steiner, Frantisek, Tupa, Jiri, Rericha, Tomas

Source: 2026 International Conference on Diagnostics in Electrical Engineering (Diagnostika) Diagnostics in Electrical Engineering (Diagnostika), 2026 International Conference on. :1-6 Sep, 2026

Relation: 2026 International Conference on Diagnostics in Electrical Engineering (Diagnostika)

ThunderFork: Splitting SMT Queries with Targeted Control-Flow Transformations

Authors: Hassan, Muhammad

Source: Companion Proceedings of the 2026 ACM SIGPLAN International Conference on Systems, Programming, Languages, and Applications: Software for Humanity. :56-58

Availability: http://dl.acm.org/doi/10.1145/3837729.3839577

Bug Composition: Triggering Multiple Bugs with Agentic Driver Generation

Authors: Arasan, Vishva, Chaudhary, Mahima, Contreras Martinez, Wendy, Shafiuzzaman, Md, Desai, Achintya, Bultan, Tevfik

Source: Proceedings of the 1st International Workshop on Agentic AI for Next-Generation Software Development. :66-76

Availability: http://dl.acm.org/doi/10.1145/3843282.3844434

Towards a Vertically Integrated Compiler Infrastructure to Improve Solver Time during Symbolic Execution

Authors: Tempel, Sören, Dietrich, Christian

Source: Proceedings of the 8th International Workshop on Automated and verifiable Software sYstem DEvelopment. :49-56

Availability: http://dl.acm.org/doi/10.1145/3843777.3844530

Verifier-in-the-Loop LLM Solving of Heap Constraints for Concolic Execution

Authors: Xia, Shaoran, Cheng, Leyi, Dong, Caihua, She, Dongdong, Wang, Bo, Peng, Xin, Dong, Zhen

Source: Proceedings of the 41st IEEE/ACM International Conference on Automated Software Engineering. :1005-1017

Availability: http://dl.acm.org/doi/10.1145/3832783.3834410

A Neuro-Symbolic Pipeline for Automated Synthesis and Verification of OCL Constraints

Authors: Ding, Yuelou, Wu, Hao

Source: Proceedings of the ACM/IEEE 29th International Conference on Model Driven Engineering Languages and Systems. :1085-1094

Availability: http://dl.acm.org/doi/10.1145/3837062.3839070

RuSMT: An Executable Semantics as Conformance Oracle and Test Suite Synthesizer

Authors: Haghshenas, Mehrad, Xu, Meng

Source: Proceedings of the 1st International Workshop on Specification-Driven Development Life Cycle. :25-34

Availability: http://dl.acm.org/doi/10.1145/3842652.3843196

SMT-based Deductive Verification of Device Drivers using the Pancake-to-Viper Transpiler

Authors: Tyler, Samuel, Legnani, Alessandro, Zhao, Junming, Shen, Zhewen, Wu, Rihui, Tanaka, Miki, Heiser, Gernot

Source: Proceedings of the 14th Workshop on Programming Languages and Operating Systems. :103-111

Availability: http://dl.acm.org/doi/10.1145/3831586.3838153

50GHz RF Bonding Method Using EIA 01005 Surface Mount Devices

Authors: Shiao, Yu-Shao, Chen, Wen-Lin, Chen, Kun-Ming, Huang, Guo-Wei

Source: 2026 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) Radio-Frequency Integration Technology (RFIT), 2026 IEEE International Symposium on. :1-3 Aug, 2026

Relation: 2026 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)

A Surface-Mount Package Based on Metal-Integrated Suspended Line (MISL) Technology

Authors: Wang, C., Wang, Y., Ma, K.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manuf. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 16(10):2423-2426 Oct, 2026

Surface Mount Ultra-Thin Millimeter-Wave Bandpass Filter Chip Based on Lithium Niobate With Ultralow Loss and Sharp Roll Off

Authors: Li, Q., Yang, Y.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 73(8):5222-5231 Aug, 2026

PolicyAgent: A Multi-Agent Generative AI Framework for Automated Reasoning Checks and Policy-Constrained Compliance in Financial Services

Authors: Goel, Shikher, Apuri, Harish

Source: 2026 18th International Conference on Electronics, Computers and Artificial Intelligence (ECAI) Electronics, Computers and Artificial Intelligence (ECAI), 2026 18th International Conference on. :1-7 Jul, 2026

Relation: 2026 18th International Conference on Electronics, Computers and Artificial Intelligence (ECAI)

Partial Automation of Verification Condition Proving for Reflex Programs

Authors: Ishchenko, Artyom, Anureev, Igor

Source: 2026 IEEE 27th International Conference of Young Professionals in Electron Devices and Materials (EDM) Young Professionals in Electron Devices and Materials (EDM), 2026 IEEE 27th International Conference of. :1-6 Jun, 2026

Relation: 2026 IEEE 27th International Conference of Young Professionals in Electron Devices and Materials (EDM)

CREQ (C-to-Rust EQuivalence): Cross-Language Semantic Verification via LLVM IR and Symbolic Execution

Authors: Fathima, A A, Raseek, C

Source: 2026 Student Multidisciplinary Innovation and Research Conference (SMIRC) Student Multidisciplinary Innovation and Research Conference (SMIRC), 2026. :1-5 Jun, 2026

Relation: 2026 Student Multidisciplinary Innovation and Research Conference (SMIRC)

Blind-Scan Angle Estimation for Surface-Mounted Antenna Arrays Using a Quasi-Analytical Approach

Authors: Wadah, Omar, Eshrah, Islam A.

Source: 2026 IEEE MTT-S Radio Frequency Technology and Techniques Symposium (IMS RFTT) MTT-S Radio Frequency Technology and Techniques Symposium (IMS RFTT), 2026 IEEE. :493-496 Jun, 2026

Relation: 2026 IEEE MTT-S Radio Frequency Technology and Techniques Symposium (IMS RFTT)

AI Head-Node Socket Interconnect Yield, Warpage, and Functionality

Authors: Klein, Steven, Abraham, Amit, Huettis, Alexander, Rawlings, Taylor, Erike, Eric, Schichtel, Jacob, Bakare, Sugadh, Aravamudhan, Srinivasa, Ooi, Renn Chan, Raghavan, Prasanna

Source: 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :1661-1665 May, 2026

Relation: 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)

Trace-Element Effects in SAC Alloys: Mitigating HIP Defects in 5G/Automotive SoC SMT Assemblies

Authors: Lin, Tai-Yin, Chen, Fa-Chuan, Chu, Che-Kuan, Lin, Chien-Min, Xu, Zhe-Cheng, Yeh, Bo-Kuan, Chen, Hsin-Long

Source: 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :1964-1969 May, 2026

Relation: 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)

Butterfly: Scalable Probabilistic Verification for Network Resilience under Failures

Authors: Ahangary, Saideh, Bos, Herbert, Gleissenthall, Klaus V., Slowinska, Asia

Source: 2026 IFIP Networking Conference (IFIP Networking) Networking Conference (IFIP Networking), 2026 IFIP. :1-6 May, 2026

Relation: 2026 IFIP Networking Conference (IFIP Networking)

Verifying an Elevator Scheduling Control System

Authors: Zhang, Huan, Lu, Haoyang, Cheng, Long, Wu, Hao

Source: 2026 IEEE International Conference on Software Testing, Verification and Validation Workshops (ICSTW) ICSTW Software Testing, Verification and Validation Workshops (ICSTW), 2026 IEEE International Conference on. :129-138 May, 2026

Relation: 2026 IEEE International Conference on Software Testing, Verification and Validation Workshops (ICSTW)